Blind Via (BVH) connection Flexible Printed Circuit (FPC)
It is a flexible substrate effective for high-density wiring. FPC
Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC
- 企業：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- 価格：Other
